Systems
PVD Sputtering Systems
Multi-Source Precision Sputtering for Advanced Thin Films
Overview
Our PVD sputtering systems support DC, RF, and Pulsed DC power sources with co-sputtering capability. Substrate heating up to 800°C. Applications include optical coatings, ITO, hard coatings, protective coatings, microelectronics patterning, and OLED TCO.
Key Features
- DC/RF/Pulsed DC power
- Co-sputtering capability
- Substrate heating to 800°C
- R&D to production scale
Technical Specifications
| Base Pressure | < 5×10⁻⁷ Torr |
|---|---|
| Substrate Size | Up to 8" wafer |
| Target Sources | 2–6 magnetron cathodes |
| Substrate Heating | RT to 800°C |
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Components
Magnetron Cathodes
Round, planar, and rotary cathodes — 2" to 12" — optimized for every deposition geometry and throughput need.
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